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R&D Furnace

Lead is an expert in the field of semiconductor furnace
equipment manufacturing and refurbishment.

Versatile Experimental Capabilities & User-Friendly Interface and Automation

Your choice of furnace equipment for creating innovations.

Wafer Size
4”~8”
Maximum Temperature
1300℃
Temperature Uniformity
400~1250℃ ± 0.5℃
Applicable Process
  • Dry/Wet Oxidation, Pocl3, BBR3, H2 Anneal, Alloy
  • High Temp
  • TEOS, LTO, NITRIDE, GPSG, POLY
Model Wafer Performance Size
VULCAN-H52RD 100mm
125mm
150mm
200mm
300mm
400~1250 ℃
Uniform Heat Zone
Between:
400~800℃ ± 1℃
800~1150℃ ± 0.5℃
Free
VULCAN-H63RD
VULCAN-H83RD
VULCAN-H12RD