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Horizontal Furnace

Lead is an expert in the field of semiconductor furnace
equipment manufacturing and refurbishment.

Furnace equipment that meets customer requirements

Equipment that meets customers’ needs for reliable heat treatment processes.

Wafer Size
150~300mm
Production Wafers
100~200
Process Application
  • Hi temp oxidation (1200~1250℃)
  • Oxidation
  • Anneal
  • H2-Alloy
  • Pocl3
  • PSPI CURE
  • D-POLY
  • POLY
  • NITIDE
  • HTO
  • TEOS
Heater Temperature Control Zone
3~5 Zones
Wafers Loading
Fully Automated
Main Software Control
PLC + PC Control
SECS, FDC Control
Model Wafer Performance Size
VULCAN-H52MD 100mm
125mm
150mm
200mm
300mm
400~1300 ℃
Uniform Heat Zone
Between:
400~800℃ ± 1℃
800~1250℃ ± 0.5℃
Free
VULCAN-H63MD
VULCAN-H83MD
VULCAN-H12MD